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/Innova attends Fispal 2014 Trade Show in Sao Paulo

INNOVA has been in Brazil, taking part on Fispal, the biggest food technology fair of Latin America which took place in Sao Paulo between the 3rd and 6th of June. In this event, the most important innovations in the field of equipment, packaging, raw material and industrial automation were showed

Again, INNOVA MAQUINARIA is present at the packaging fairs to create relations with new clients, suppliers and competitors. Furthermore, INNOVA has the opportunity to see the last news of the packaging sector. There, we could attend to our Latin American Clients and closely knew the most recent innovations of American end-of-line systems.

Fispal Technology has become a reference point of integrated solutions by means of projects and events that internationally contribute to the development of food packaging sector. Because of that, INNOVA, which shares the same principles of innovation and adaptable solutions for our clients, is waiting to the next edition in 2015.

 
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